Material : Corning 7980 0f UV Grade Fused Silica,

Dimensions : 100mm +/- .2mm diameter x 1mm +/- .025mm thick

3.93'' +/-.00787'' diameter x .0394'' +/- .001'' thick,

With reference flat measuring 32.5mm +/-2.5mm (=1.27'' +/- .098'') long

polished both sides 40/20 scratch/dig,

TTV = <10 microns, 

Edges 22 degrees blended edge profile

Ultrasonic wash

class 100 clean room inspection,

Wafer container packaging, double bagged/vaccum-sealed

WAF01006

Data sheet

Matière
Silice fondue

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Brochure composants optiques

Solutions optiques sur-mesures

Download (3.66M)

Brochure Wafers VDC

Solutions de substrat

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